The New York Times Agency May 2010
EN_00913897_0162
(NYT2) UNDATED -- Nov. 10, 2002 -- IBM-CHIPS -- IBM has developed a technique for stacking chip components on silicon wafers in layers so thin that the wafers are translucent, a technique that may one day be essential in building creating faster microprocessors and higher-capacity memory chips. Photograph of a 200 mm-diameter stack showing a fully processed circuit transferred onto glass. (The New York Times)
CENA MINIMALNA - 100 USD
2002-11-10
EAST NEWS
The New York Times Agency
The New York Times/Redux
15342781
0,46MB
17cm x 13cm by 300dpi
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